An electronic component mount structure includes an electronic component and a mount substrate. The electronic component includes a multilayer body including dielectric layers, internal electrode layers and an insulating layer stacked in a stacking direction. The multilayer body includes two main surfaces opposed to each other in the stacking direction, two side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and two end surfaces opposed to each other in a length direction perpendicular to the stacking and width directions. An insulator is provided on the side surfaces of the multilayer body. The mount substrate includes a land electrode on a mount surface. The electronic component is mounted on the land electrode with a solder fillet being interposed such that the side surfaces are perpendicular to the mount surface. The land electrode is smaller in the width direction than the electronic component.