Invention Grant
- Patent Title: Method of manufacturing element chip and element chip
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Application No.: US15408703Application Date: 2017-01-18
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Publication No.: US10475704B2Publication Date: 2019-11-12
- Inventor: Atsushi Harikai , Shogo Okita , Noriyuki Matsubara , Mitsuru Hiroshima , Mitsuhiro Okune
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2016-019868 20160204
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/311 ; H01L21/02 ; H01L21/3065 ; H01L23/31 ; H01L23/29
Abstract:
In a plasma processing step that is used in the method of manufacturing the element chip for manufacturing a plurality of element chips by dividing a substrate having a plurality of element regions, the substrate is divided into element chips 10 by exposing the substrate to a first plasma. Therefore, element chips having a first surface, a second surface, and a side surface connecting the first surface and the second surface are held spaced from each other on a carrier. A protection film covering the element chip is formed only on the side surface and it is possible to suppress creep-up of a conductive material to the side surface in the mounting step by exposing the element chips to second plasma in which a mixed gas of fluorocarbon and helium is used as a raw material gas.
Public/Granted literature
- US20170229365A1 METHOD OF MANUFACTURING ELEMENT CHIP AND ELEMENT CHIP Public/Granted day:2017-08-10
Information query
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