Invention Grant
- Patent Title: Die bonder and methods of using the same
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Application No.: US14686142Application Date: 2015-04-14
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Publication No.: US10475764B2Publication Date: 2019-11-12
- Inventor: Chen-Hua Yu , Shing-Chao Chen , Chung-Shi Liu , Ming-Da Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; B32B37/02 ; B32B38/18 ; H01L21/56
Abstract:
A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film.
Public/Granted literature
- US20160190088A1 Die Bonder and Methods of Using the Same Public/Granted day:2016-06-30
Information query
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