Invention Grant
- Patent Title: Method of forming gate-all-around (GAA) FinFET and GAA FinFET formed thereby
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Application No.: US16190549Application Date: 2018-11-14
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Publication No.: US10475899B2Publication Date: 2019-11-12
- Inventor: Ruilong Xie , Andreas Knorr , Julien Frougier , Hui Zang , Min-hwa Chi
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Yee Tze Lim
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/06 ; H01L29/49 ; H01L29/786 ; H01L27/088

Abstract:
A method of forming a GAA FinFET, including: forming a fin on a substrate, the substrate having a STI layer formed thereon and around a portion of a FIN-bottom portion of the fin, the fin having a dummy gate formed thereover, the dummy gate having a gate sidewall spacer on sidewalls thereof; forming a FIN-void and an under-FIN cavity in the STI layer; forming first spacers by filling the under-FIN cavity and FIN-void with a first fill; removing the dummy gate, thereby exposing both FIN-bottom and FIN-top portions of the fin underneath the gate; creating an open area underneath the exposed FIN-top by removing the exposed FIN-bottom; and forming a second spacer by filling the open area with a second fill; wherein a distance separates a top-most surface of the second spacer from a bottom-most surface of the FIN-top portion. A GAA FinFET formed by the method is also disclosed.
Public/Granted literature
- US20190123160A1 METHOD OF FORMING GATE-ALL-AROUND (GAA) FINFET AND GAA FINFET FORMED THEREBY Public/Granted day:2019-04-25
Information query
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