Invention Grant
- Patent Title: Molded portion-equipped electrical wire
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Application No.: US16093900Application Date: 2017-03-28
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Publication No.: US10476182B2Publication Date: 2019-11-12
- Inventor: Hitoshi Horio , Kouji Fukumoto , Daisuke Hashimoto
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRICAL INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRICAL INDUSTRIES, LTD.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff PLC
- Priority: JP2016-080028 20160413
- International Application: PCT/JP2017/012606 WO 20170328
- International Announcement: WO2017/179410 WO 20171019
- Main IPC: H01R4/70
- IPC: H01R4/70 ; H01R4/72 ; H01R11/12

Abstract:
A molded portion-equipped electrical wire that includes a conductor; a terminal connected to an end of the conductor; a mold covering a portion at which the conductor and the terminal are connected such that the terminal protrudes from one end side of the mold and the conductor protrudes from another end side of the mold; an insulating covering that covers a periphery of the mold and the conductor and is obtained due to a thermal contraction tube contracting; and a body that is provided on an outer circumferential surface of the mold and includes a level difference forming surface facing the one end side, wherein an end of the covering is caught on a level difference portion formed by the level difference forming surface, and the body is made of an elastic material.
Public/Granted literature
- US20190131725A1 MOLDED PORTION-EQUIPPED ELECTRICAL WIRE Public/Granted day:2019-05-02
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