Invention Grant
- Patent Title: Socket for electrical component
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Application No.: US16301411Application Date: 2017-05-12
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Publication No.: US10476220B2Publication Date: 2019-11-12
- Inventor: Takashi Morinari
- Applicant: ENPLAS CORPORATION
- Applicant Address: JP Kawaguchi-shi
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Kawaguchi-shi
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2016-097247 20160513
- International Application: PCT/JP2017/018080 WO 20170512
- International Announcement: WO2017/195896 WO 20171116
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R33/76 ; G01K1/14 ; G01R31/26 ; G01R1/04 ; G01R31/28

Abstract:
An IC socket includes: a heat transfer member attached to a socket body in a manner capable of contacting an electrical component and having an opening penetratingly formed at a contact surface that contacts the electrical component accommodated in the socket body; and a temperature sensor that is mounted in the opening of the heat transfer member and has a rod-like tip end portion including a thermosensitive element and extending toward the electrical component, in which the tip end portion, as well as the heat transfer member, contacts the electrical component. In the IC socket, a tubular component having an insertion hole in which an outer surface of a portion of the temperature sensor other than the tip end portion is fitted in a slidable manner in the axial direction of the temperature sensor, is attached to the opening.
Public/Granted literature
- US20190207351A1 SOCKET FOR ELECTRICAL COMPONENT Public/Granted day:2019-07-04
Information query