Invention Grant
- Patent Title: Laminated body
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Application No.: US15763736Application Date: 2016-09-29
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Publication No.: US10477671B2Publication Date: 2019-11-12
- Inventor: Hiroshi Maenaka , Osamu Inui
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2015-195409 20150930
- International Application: PCT/JP2016/078790 WO 20160929
- International Announcement: WO2017/057553 WO 20170406
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B32B15/08 ; H05K1/03 ; B32B15/092 ; B32B15/20 ; B32B27/20 ; B32B27/26 ; B32B27/28 ; B32B27/30 ; B32B27/34 ; B32B27/40 ; B32B27/42

Abstract:
There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 μm or less, the total thickness of the first metal material and the second metal material is 200 μm or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.2 or more and 5 or less, and the ratio of the surface area of a surface opposite to the insulating resin layer side of the first metal material to the surface area of a surface opposite to the insulating resin layer side of the second metal material is 0.5 or more and 2 or less.
Public/Granted literature
- US20180302976A1 LAMINATED BODY Public/Granted day:2018-10-18
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