Invention Grant
- Patent Title: Ink composition for light sintering, wiring board using same and manufacturing method therefor
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Application No.: US16118096Application Date: 2018-08-30
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Publication No.: US10477680B2Publication Date: 2019-11-12
- Inventor: Yoonjin Kim , Jinwoo Cho , Kwonwoo Shin , Yonggon Seo , Yeonwon Kim , Sanghyeon Jang , Namje Jo
- Applicant: Korea Electronics Technology Institute
- Applicant Address: KR Gyeonggi-do
- Assignee: Korea Electronics Technology Institute
- Current Assignee: Korea Electronics Technology Institute
- Current Assignee Address: KR Gyeonggi-do
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: KR10-2014-0038579 20140401; KR10-2014-0186689 20141223; KR10-2014-0186691 20141223
- Main IPC: H01B1/20
- IPC: H01B1/20 ; H05K1/00 ; C09D11/00 ; H05K1/09 ; B22F9/24 ; C09D11/52 ; H01B1/22 ; B22F1/00 ; B22F1/02 ; C09D11/037 ; H05K3/02 ; H05K3/12 ; H05K3/22
Abstract:
The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.
Public/Granted literature
- US20180376592A1 INK COMPOSITION FOR LIGHT SINTERING, WIRING BOARD USING SAME AND MANUFACTURING METHOD THEREFOR Public/Granted day:2018-12-27
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