Invention Grant
- Patent Title: Ink composition for light sintering, wiring board using same and manufacturing method therefor
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Application No.: US16118212Application Date: 2018-08-30
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Publication No.: US10477681B2Publication Date: 2019-11-12
- Inventor: Yoonjin Kim , Jinwoo Cho , Kwonwoo Shin , Yonggon Seo , Yeonwon Kim , Sanghyeon Jang , Namje Jo
- Applicant: Korea Electronics Technology Institute
- Applicant Address: KR Gyeonggi-do
- Assignee: Korea Electronics Technology Institute
- Current Assignee: Korea Electronics Technology Institute
- Current Assignee Address: KR Gyeonggi-do
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: KR10-2014-0038579 20140401; KR10-2014-0186689 20141223; KR10-2014-0186691 20141223
- Main IPC: H01B1/20
- IPC: H01B1/20 ; H05K1/00 ; C09D5/24 ; H05K1/09 ; B22F9/24 ; C09D11/52 ; H01B1/22 ; B22F1/00 ; B22F1/02 ; C09D11/037 ; H05K3/02 ; H05K3/12 ; H05K3/22
Abstract:
The present invention provides a method of fabricating a wiring board and a wiring board fabricated by the method, the method including a step of screen-printing the ink composition for light sintering on a flexible board body to form a preliminary wiring pattern, a step of drying the preliminary wiring pattern, and a step of reducing and sintering the oxidized copper of the copper oxide nanoparticles, which are included in the preliminary wiring pattern, by irradiating the dried preliminary wiring pattern with light to form a wiring pattern on the board body.
Public/Granted literature
- US20180376593A1 INK COMPOSITION FOR LIGHT SINTERING, WIRING BOARD USING SAME AND MANUFACTURING METHOD THEREFOR Public/Granted day:2018-12-27
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