Invention Grant
- Patent Title: Flexible circuit board
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Application No.: US16075198Application Date: 2017-02-08
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Publication No.: US10477690B2Publication Date: 2019-11-12
- Inventor: Ik Soo Kim , Byung Yeol Kim , Sang Pil Kim , Da Yeon Lee , Hwang Sub Koo , Hyun Je Kim , Hee Seok Jung
- Applicant: GIGALANE CO., LTD.
- Applicant Address: KR Hwaseong-si, Gyeonggi-Do
- Assignee: GIGALANE CO., LTD.
- Current Assignee: GIGALANE CO., LTD.
- Current Assignee Address: KR Hwaseong-si, Gyeonggi-Do
- Agency: Brundidge & Stanger, P.C.
- Priority: KR10-2016-0015777 20160211
- International Application: PCT/KR2017/001374 WO 20170208
- International Announcement: WO2017/138745 WO 20170817
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01P3/08 ; H05K1/02
Abstract:
A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
Public/Granted literature
- US20190053379A1 FLEXIBLE CIRCUIT BOARD Public/Granted day:2019-02-14
Information query
