Invention Grant
- Patent Title: Clustered heat dissipation device and chassis with same
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Application No.: US16217390Application Date: 2018-12-12
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Publication No.: US10477725B2Publication Date: 2019-11-12
- Inventor: Chien-An Chen , Mu-Shu Fan , Chien-Yu Chen
- Applicant: AURAS Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: WPAT, PC
- Priority: TW107143053A 20181130
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/00 ; F28F21/02 ; F28F21/08 ; H05K5/02

Abstract:
A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.
Public/Granted literature
- US20190182984A1 CLUSTERED HEAT DISSIPATION DEVICE AND CHASSIS WITH SAME Public/Granted day:2019-06-13
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