Invention Grant
- Patent Title: Thermally-conductive electromagnetic interference (EMI) absorbers positioned or positionable between board level shields and heat sinks
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Application No.: US15936045Application Date: 2018-03-26
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Publication No.: US10477739B2Publication Date: 2019-11-12
- Inventor: Paul Francis Dixon , Mohammadali Khorrami
- Applicant: Laird Technologies, Inc.
- Applicant Address: unknown Chesterfield
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: unknown Chesterfield
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K1/18
Abstract:
According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.
Public/Granted literature
Information query
