Invention Grant
- Patent Title: Substrate liquid processing apparatus, substrate liquid processing method, and storage medium
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Application No.: US15649757Application Date: 2017-07-14
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Publication No.: US10483137B2Publication Date: 2019-11-19
- Inventor: Hiroyuki Masutomi , Toshiyuki Shiokawa , Koji Tanaka , Takami Satoh
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2016-144781 20160722
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/311 ; G02F1/1333 ; H01L21/8234 ; G02F1/13
Abstract:
The substrate liquid processing apparatus includes a processing bath that accommodates substrates, and a plurality of gas supply pipes provided in a processing bath. Ejection holes of one gas supply pipe and ejection holes of another adjacent gas supply pipe do not overlap each other in a direction parallel to the circuit-formed surfaces of the substrates.
Public/Granted literature
- US20180025927A1 SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD, AND STORAGE MEDIUM Public/Granted day:2018-01-25
Information query
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