Invention Grant
- Patent Title: Resin board, method of manufacturing resin board, circuit board, and method of manufacturing circuit board
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Application No.: US15620091Application Date: 2017-06-12
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Publication No.: US10483195B2Publication Date: 2019-11-19
- Inventor: Yasushi Kobayashi , Yoshihiro Nakata , Yoshikatsu Ishizuki , Daijiro Ishibashi , Shinya Sasaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-122946 20160621
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L21/683
Abstract:
A resin board includes: a resin layer and a through electrode buried in the resin layer, wherein the through electrode has an electrode surface exposed from a front surface or a back surface of the resin layer and a lateral surface, and the electrode surface and the lateral surface form an obtuse angle.
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