Invention Grant
- Patent Title: Bonding package components through plating
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Application No.: US15632686Application Date: 2017-06-26
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Publication No.: US10483230B2Publication Date: 2019-11-19
- Inventor: Zheng-Yi Lim , Yi-Wen Wu , Tzong-Hann Yang , Ming-Che Ho , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L23/522 ; H01L23/528 ; H01L29/423 ; H01L23/00 ; H01L23/31 ; H01L25/10 ; H01L25/00 ; H01L23/498 ; H01L25/065 ; H01L21/56
Abstract:
A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
Public/Granted literature
- US20170294402A1 Bonding Package Components Through Plating Public/Granted day:2017-10-12
Information query
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