Invention Grant
- Patent Title: Component, substrate module, apparatus, and optical filter
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Application No.: US15752271Application Date: 2016-07-22
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Publication No.: US10483438B2Publication Date: 2019-11-19
- Inventor: Hiizu Ootorii
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2015-175062 20150904
- International Application: PCT/JP2016/003430 WO 20160722
- International Announcement: WO2017/037996 WO 20170309
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L21/52 ; H01L33/62 ; H01L33/44 ; H01L23/00 ; H01S5/022

Abstract:
A component includes a main body, a first layer, and a second layer. The main body includes a bottom surface. The first layer is provided on the bottom surface of the main body and includes a bottom surface. The second layer is bonded to a metal bonding material on a substrate to be provided physically integrally. The second layer has higher wettability with respect to the metal bonding material in a molten state than the first layer, and protrudes from the bottom surface side of the first layer such that at least a part of the bottom surface of the first layer is exposed on an entire outer circumference side of the second layer.
Public/Granted literature
- US20180240942A1 COMPONENT, SUBSTRATE MODULE, APPARATUS, AND OPTICAL FILTER Public/Granted day:2018-08-23
Information query
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