Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US15997748Application Date: 2018-06-05
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Publication No.: US10483618B2Publication Date: 2019-11-19
- Inventor: Seung Wook Park , Tah Joon Park , Jae Hyun Jung , Hwa Sun Lee , Seong Hun Na
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2017-0145398 20171102
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01Q1/22 ; H01Q1/44 ; G06K19/077 ; H01L23/66 ; H01L23/31 ; H01L23/00 ; H01L23/538 ; H01Q1/48 ; H01Q9/04 ; H01Q21/00 ; H01Q21/06 ; H01Q1/40 ; H01Q21/30
Abstract:
A semiconductor package includes a lower package including at least one electronic device, and an antenna unit disposed on an upper surface of the lower package, wherein the antenna unit includes: a ground portion disposed on an upper surface of the lower package, a radiating portion disposed to be spaced apart from the ground portion, and a support portion separating the radiating portion and the ground portion, and at least a portion between the radiating portion and the grounding portion is empty space.
Public/Granted literature
- US20190131689A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-05-02
Information query
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