- Patent Title: Measurement processing device, x-ray inspection apparatus, method for manufacturing structure, measurement processing method, x-ray inspection method, measurement processing program, and x-ray inspection program
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Application No.: US15446455Application Date: 2017-03-01
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Publication No.: US10502562B2Publication Date: 2019-12-10
- Inventor: Nobukatsu Machii , Fuminori Hayano , Akitoshi Kawai
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: G01B15/02
- IPC: G01B15/02 ; G01B15/04 ; G01N23/046 ; G01N23/04

Abstract:
A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a predetermined region of a specimen placed on a placement unit to perform an inspection on the shape of the predetermined region of the specimen includes: a setting unit that sets a three-dimensional region to be detected on the specimen; and a sliced-region selection unit that sets a plurality of sliced regions on the region to be detected, calculates, for each of the plurality of sliced regions, an amount of displacement of the predetermined region that is required to detect the region to be detected when the plurality of sliced regions is regarded as the predetermined region, and selects a sliced region for the inspection from among the plurality of sliced regions on the basis of each of the calculated amounts of displacement.
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