Invention Grant
- Patent Title: CMOS compatible non-filamentary resistive memory stack
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Application No.: US16018715Application Date: 2018-06-26
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Publication No.: US10505112B1Publication Date: 2019-12-10
- Inventor: Takashi Ando , Eduard A. Cartier , Adam M. Pyzyna , John Bruley
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
CMOS-compatible non-filamentary RRAM devices and techniques for formation thereof are provided. In one aspect, a method of forming a non-filamentary RRAM device includes: depositing a base oxide layer (e.g., hafnium oxide) on a bottom electrode; depositing a cap layer (e.g., amorphous silicon) on the base oxide layer; and depositing a top electrode on the cap layer, wherein the cap layer and the top electrode are deposited in-situ without any air exposure in between such that there is an absence of oxide at an interface between the cap layer and the top electrode. A low resistivity layer can optionally be deposited on the top electrode. An RRAM device and a computing device having a crossbar array of the present RRAM cells are also provided.
Public/Granted literature
- US20190393413A1 CMOS Compatible Non-Filamentary Resistive Memory Stack Public/Granted day:2019-12-26
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