Invention Grant
- Patent Title: Systems and methods for cell abutment
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Application No.: US15334918Application Date: 2016-10-26
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Publication No.: US10509882B2Publication Date: 2019-12-17
- Inventor: Wan-Ru Lin , Ching-Shun Yang
- Applicant: Taiwan Semiconductor Manufacturing, Co., Ltd.
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The present disclosure is directed to systems and methods for cell placement. In embodiments, the methods include placing a plurality of cells selected from a cell library in a chip design to produce a first cell placement and determining whether the first cell placement satisfies design demands. In further embodiments, the method also includes rearranging a first cell to abut the first cell with a second cell when the first cell placement fails to satisfy design demands. In still further embodiments, the first cell is rearranged until a second cell placement providing a minimum metal route between the first and second cells is determined. In various embodiments, the method further includes generating a design layout based on the second cell placement and outputting the design layout to a machine readable storage medium. The outputted layout is used to manufacture a set of masks used in chip fabrication processes.
Public/Granted literature
- US20180046744A1 SYSTEMS AND METHODS FOR CELL ABUTMENT Public/Granted day:2018-02-15
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