Invention Grant
- Patent Title: Array substrate and method for fabricating the same, and display device
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Application No.: US15321812Application Date: 2016-03-03
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Publication No.: US10510779B2Publication Date: 2019-12-17
- Inventor: Chunsheng Jiang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Armstrong Teasdale LLP
- Priority: CN201510166992 20150409
- International Application: PCT/CN2016/075430 WO 20160303
- International Announcement: WO2016/161860 WO 20161013
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/45 ; H01L21/321 ; H01L29/786

Abstract:
The present disclose provides in some embodiments an array substrate and a method for fabricating the same, and a display device. The array substrate includes a source-drain metal layer formed on a base substrate and including copper, an alloy layer formed on the source-drain metal layer and including copper alloy, non-copper metal in the copper alloy being easier to be oxidized than copper in the copper alloy, a passivation layer formed on the alloy layer, and an oxide layer formed between the alloy layer and the passivation layer.
Public/Granted literature
- US20170133403A1 ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME, AND DISPLAY DEVICE Public/Granted day:2017-05-11
Information query
IPC分类: