Invention Grant
- Patent Title: Impact ionization semiconductor device and manufacturing method thereof
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Application No.: US15649331Application Date: 2017-07-13
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Publication No.: US10510903B2Publication Date: 2019-12-17
- Inventor: Tuo-Hung Hou , Samuel C. Pan , Pang-Shiuan Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , NATIONAL CHIAO TUNG UNIVERSITY
- Applicant Address: TW Hsinchu TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL CHIAO TUNG UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL CHIAO TUNG UNIVERSITY
- Current Assignee Address: TW Hsinchu TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/04 ; H01L29/417 ; H01L29/66 ; H01L29/78 ; H01L21/28 ; H01L29/423 ; H01L29/786 ; H01L29/47

Abstract:
A semiconductor device including a field effect transistor (FET) device includes a substrate and a channel structure formed of a two-dimensional (2D) material over the substrate. Source and drain contacts are formed partially over the 2D material. A first dielectric layer is formed at least partially over the channel structure and at least partially over the source and drain contacts. The first dielectric layer is configured to trap charge carriers. A second dielectric layer is formed over the first dielectric layer, and a gate electrode is formed over the second dielectric layer.
Public/Granted literature
- US20180151755A1 IMPACT IONIZATION SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-05-31
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