Invention Grant
- Patent Title: Package support, fabrication method and LED package
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Application No.: US15621351Application Date: 2017-06-13
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Publication No.: US10510938B2Publication Date: 2019-12-17
- Inventor: Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201420075500U 20140221; CN201420695174U 20141119; CN201420822588U 20141223
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/54 ; H01L33/64 ; H01L25/075 ; H01L33/48 ; H01L33/50 ; H01L23/00
Abstract:
A light-emitting diode (LED) package includes a substrate with upper and lower surfaces, including: a metal block; an electrically insulating region surrounding at least a portion of the metal block; an LED chip mounted on the substrate and in electrical communication with the metal block; and an encapsulant covering at least an upper surface of the LED chip. A light-emitting system includes a plurality of light-emitting diode (LED) chips; and a package support for the plurality of LED chips.
Public/Granted literature
- US20170279023A1 PACKAGE SUPPORT, FABRICATION METHOD AND LED PACKAGE Public/Granted day:2017-09-28
Information query
IPC分类:
