Invention Grant
- Patent Title: Headphone
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Application No.: US15952858Application Date: 2018-04-13
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Publication No.: US10511900B2Publication Date: 2019-12-17
- Inventor: Daisuke Yoneyama , Koji Otsuka , Yumi Shimazaki
- Applicant: KABUSHIKI KAISHA AUDIO-TECHNICA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA AUDIO-TECHNICA
- Current Assignee: KABUSHIKI KAISHA AUDIO-TECHNICA
- Current Assignee Address: JP Tokyo
- Agency: W&C IP
- Priority: JP2017-110726 20170605
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/28

Abstract:
A headphone includes a driver unit 2, the first housing 4 that forms a first air chamber 11 on a back side of the driver unit 2, the second housing 5 that forms a second air chamber 12 on an opposite side of an inner surface different from an inner surface where the driver unit 2 is provided in the first housing 4, and a damper 61 provided in the second housing 5. In the first housing 4, an opening 44 that communicates between the first air chamber 11 and the second air chamber 12 is formed.
Public/Granted literature
- US20180352318A1 HEADPHONE Public/Granted day:2018-12-06
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