A method (of generating a layout diagram of a conductive line structure includes: determining that a first set of first to fourth short pillar patterns (which represent portions of an M(i) layer of metallization and are located relative to a grid), violates a minimum transverse-routing (TVR) distance of alpha-direction-separation, wherein (1) the grid has orthogonal alpha and beta tracks, and (2) the short pillar patterns have long axes which are substantially co-track aligned with a first one of the alpha tracks and have a first distance (of alpha-direction-separation between immediately adjacent members of the first set) which is less than the TVR distance; and merging pairings of the first & second and third & fourth short pillar patterns into corresponding first and second medium pillar patterns which have a second distance of alpha-direction-separation therebetween; the second value being greater than the TVR distance.