Invention Grant
- Patent Title: Compressible housing
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Application No.: US16076548Application Date: 2017-01-31
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Publication No.: US10515770B2Publication Date: 2019-12-24
- Inventor: Scott Gregory
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2017/015786 WO 20170131
- International Announcement: WO2018/143927 WO 20180809
- Main IPC: H01H13/04
- IPC: H01H13/04 ; G06K7/14 ; H01H1/58 ; H01H13/26 ; H01H3/00

Abstract:
Examples relate to a compressible housing. An electronic switch may include a circuit board. A first conductive surface may be coupled to the circuit board and a second conductive surface may be located proximate to the first conductive surface. A compressible spacer may be located between the first conductive surface and the second conductive surface to space the first conductive surface away from the second conductive surface. Further, a compressible housing may deform when under compression and may cause, via deformation of the compressible spacer, the first conductive surface to contact the second conductive surface.
Public/Granted literature
- US20190051470A1 COMPRESSIBLE HOUSING Public/Granted day:2019-02-14
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