Invention Grant
- Patent Title: Bump on pad (BOP) bonding structure in semiconductor packaged device
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Application No.: US16221851Application Date: 2018-12-17
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Publication No.: US10515917B2Publication Date: 2019-12-24
- Inventor: Yao-Chun Chuang , Chita Chuang , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/488 ; H01L23/498 ; H01L25/10
Abstract:
The embodiments described above provide enlarged overlapping surface areas of bonding structures between a package and a bonding substrate. By using elongated bonding structures on either the package and/or the bonding substrate and by orienting such bonding structures, the bonding structures are designed to withstand bonding stress caused by thermal cycling to reduce cold joints.
Public/Granted literature
- US20190123008A1 Bump on Pad (BOP) Bonding Structure in Semiconductor Packaged Device Public/Granted day:2019-04-25
Information query
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