Invention Grant
- Patent Title: Methods of and devices for reducing structure noise through self-structure analysis
-
Application No.: US15687605Application Date: 2017-08-28
-
Publication No.: US10521959B2Publication Date: 2019-12-31
- Inventor: Je-Hyun Lee , Sung-Hwan Jang , Sung-Youn Chung , Jae-Hoon Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2016-0165559 20161207
- Main IPC: G06F17/30
- IPC: G06F17/30 ; G06T17/20 ; G06K9/62 ; G06K9/00 ; G06K9/40 ; G06T19/20

Abstract:
To reduce structure noise, input data representing an input structure is obtained and boundary conditions are set by classifying data of each of multiple structure elements of the input data as a signal component or a noise component. A smoothing operation is performed with respect to the input data and based on the boundary conditions. Output data representing an output structure is provided by reducing noise from the input structure.
Public/Granted literature
- US20180158241A1 METHODS OF AND DEVICES FOR REDUCING STRUCTURE NOISE THROUGH SELF-STRUCTURE ANALYSIS Public/Granted day:2018-06-07
Information query