An electronic component includes a component main body including an embedded internal conductor and an outer electrode. The component main body includes an end surface on which the internal conductor is exposed, and a main surface that is continuous with the end surface and intersects with the end surface. The outer electrode includes an end surface covering portion connected to the internal conductor by covering at least a portion of the internal conductor exposed on the end surface, and a main surface covering portion that covers at least a portion of the main surface. At least a portion of an exposed surface of the main surface covering portion includes a Sn plating layer, and at least a portion of an exposed surface of the end surface covering portion includes a Sn—Ni layer.