Invention Grant
- Patent Title: FinFET device and methods of forming same
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Application No.: US15964253Application Date: 2018-04-27
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Publication No.: US10522358B2Publication Date: 2019-12-31
- Inventor: Chun-Chieh Wang , Zheng-Yang Pan , Shih-Chieh Chang , Cheng-Han Lee , Huai-Tei Yang , Shahaji B. More
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/66 ; H01L27/092 ; H01L21/3215 ; H01L29/51 ; H01L29/78 ; H01L29/49 ; H01L21/8238

Abstract:
A FinFET device and method of forming the same are disclosed. The method includes forming a gate dielectric layer and depositing a metal oxide layer over the gate dielectric layer. The method also includes annealing the gate dielectric layer and the metal oxide layer, causing ions to diffuse from the metal oxide layer to the gate dielectric layer to form a doped gate dielectric layer. The method also includes forming a work function layer over the doped gate dielectric layer, and forming a gate electrode over the work function layer.
Public/Granted literature
- US20190067011A1 FinFET Device and Methods of Forming Same Public/Granted day:2019-02-28
Information query
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