- Patent Title: Method of processing workpiece including cutting step that uses cutting fluid with organic acid and oxidizing agent to reduce ductility of layered bodies containing metal
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Application No.: US15941131Application Date: 2018-03-30
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Publication No.: US10522405B2Publication Date: 2019-12-31
- Inventor: Kenji Takenouchi
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Green Burns & Crain, Ltd.
- Priority: JP2017-074469 20170404
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B28D5/00 ; H01L21/67 ; B28D5/02
Abstract:
A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
Public/Granted literature
- US20180286757A1 METHOD OF PROCESSING WORKPIECE Public/Granted day:2018-10-04
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