Invention Grant
- Patent Title: Illumination assembly, method of manufacturing the illumination assembly, and backlight module including the illumination assembly
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Application No.: US16406711Application Date: 2019-05-08
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Publication No.: US10522521B2Publication Date: 2019-12-31
- Inventor: Yu-Chuan Lin , Pen-Yi Liao , Hui-Ching Chuang , Chih-Hao Chen , Ai-Ling Lin
- Applicant: Taiwan Green Point Enterprises Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Taiwan Green Point Enterprises Co., Ltd.
- Current Assignee: Taiwan Green Point Enterprises Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Priority: TW103135791A 20141015
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/075 ; H01L33/60 ; H01L33/62

Abstract:
An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.
Public/Granted literature
Information query
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