Invention Grant
- Patent Title: Structure and formation method of semiconductor device with gate stacks
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Application No.: US15227207Application Date: 2016-08-03
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Publication No.: US10522536B2Publication Date: 2019-12-31
- Inventor: Che-Cheng Chang , Chih-Han Lin , Horng-Huei Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L23/31 ; H01L29/06 ; H01L29/66 ; H01L21/8234

Abstract:
Structures and formation methods of a semiconductor device are provided. The semiconductor device includes a substrate and a first fin structure and a second fin structure over the substrate. The semiconductor device also includes a first gate stack and a second gate stack partially covering the first fin structure and the second fin structure, respectively, and a stack structure over the substrate. The stack structure is between the first gate stack and the second gate stack. The stack structure includes a semiconductor layer over the substrate and a protection layer over the semiconductor layer.
Public/Granted literature
- US20180040613A1 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACKS Public/Granted day:2018-02-08
Information query
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