Invention Grant
- Patent Title: Manufacturing method of three-dimensional semiconductor device
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Application No.: US16394867Application Date: 2019-04-25
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Publication No.: US10522563B2Publication Date: 2019-12-31
- Inventor: Nam Jae Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2017-0092484 20170721; KR10-2018-0015195 20180207
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11524 ; H01L27/11556 ; H01L21/768 ; H01L23/528 ; H01L23/522 ; H01L27/1157

Abstract:
A semiconductor device includes a first channel layer and a second channel layer, each extending from an upper portion to a lower portion; and word lines stacked toward the upper portion from the lower portion, the word lines spaced apart from each other, the word lines each extending to surround the first channel layer and the second layer; a first lower select group surrounding a portion of the first channel layer that further protrudes toward the lower portion than the word lines; and a second lower select group surrounding a portion of the second channel layer that further protrudes toward the lower portion than the word lines.
Public/Granted literature
- US20190252406A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-08-15
Information query
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