Invention Grant
- Patent Title: Memory devices and methods of manufacturing the same
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Application No.: US15334750Application Date: 2016-10-26
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Publication No.: US10522595B2Publication Date: 2019-12-31
- Inventor: Masayuki Terai
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2015-0149726 20151027
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00

Abstract:
A semiconductor device includes: a first memory cell, a bit line and a second memory cell. The first memory cell has a first stack structure including a first memory layer between a first heater electrode and a first ovonic threshold switching device. The bit line is on the first memory cell. The second memory cell is on the bit line, and has a second stack structure including a second memory layer between a second ovonic threshold switching device and a second heater electrode. The first and second stack structures are symmetrical with respect to the bit line.
Public/Granted literature
- US20170117328A1 MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2017-04-27
Information query
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