Invention Grant
- Patent Title: Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions
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Application No.: US15841479Application Date: 2017-12-14
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Publication No.: US10522745B2Publication Date: 2019-12-31
- Inventor: Sahil Patel , Guenole Jan , Ru-Ying Tong , Vignesh Sundar , Dongna Shen , Yu-Jen Wang , Po-Kang Wang , Huanlong Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Haynes and Boone, LLP
- Main IPC: H01L43/08
- IPC: H01L43/08 ; H01L27/22 ; H01L43/10 ; H01L43/12

Abstract:
A magnetic tunnel junction (MTJ) is disclosed wherein a free layer (FL) interfaces with a first metal oxide (Mox) layer and second metal oxide (tunnel barrier) to produce perpendicular magnetic anisotropy (PMA) in the FL. In some embodiments, conductive metal channels made of a noble metal are formed in the Mox that is MgO to reduce parasitic resistance. In a second embodiment, a discontinuous MgO layer with a plurality of islands is formed as the Mox layer and a non-magnetic hard mask layer is deposited to fill spaces between adjacent islands and form shorting pathways through the Mox. In another embodiment, end portions between the sides of a center Mox portion and the MTJ sidewall are reduced to form shorting pathways by depositing a reducing metal layer on Mox sidewalls, or performing a reduction process with forming gas, H2, or a reducing species.
Public/Granted literature
- US20190189910A1 Low Resistance MgO Capping Layer for Perpendicularly Magnetized Magnetic Tunnel Junctions Public/Granted day:2019-06-20
Information query
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