Invention Grant
- Patent Title: High density receptacle
-
Application No.: US16043612Application Date: 2018-07-24
-
Publication No.: US10522931B2Publication Date: 2019-12-31
- Inventor: Hazelton P. Avery , Pu Xie , Philip J. Dambach , Li Zhuang
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agency: Molex, LLC
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/405 ; H01R13/518 ; H01R13/631 ; H01R13/6581 ; H01R13/26 ; H01R13/24 ; H01R13/6587 ; H01R12/70 ; H01R12/71

Abstract:
A connector assembly is provided, which includes a cage that defines a port and a card slot positioned in the port. Also included is a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals. The terminals are arranged so that two rows of contacts are provided, one row on a first side and one row on a second side of the card slot. Each wafer of the plurality of wafers includes an insulative frame, each terminal includes a beam portion cantilevered from the insulative frame supporting that terminal, and the cantilevered beam portion of at least one terminal of the at least four terminals has a molded material thereon.
Public/Granted literature
- US20190036263A1 HIGH DENSITY RECEPTACLE Public/Granted day:2019-01-31
Information query