Invention Grant
- Patent Title: Hybrid implant system and manufacturing method therefor
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Application No.: US15874532Application Date: 2018-01-18
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Publication No.: US10525173B2Publication Date: 2020-01-07
- Inventor: Ling Qin , Yuk Sun Cheng , Ning Tang , Wing Ho Chau
- Applicant: The Chinese University of Hong Kong
- Applicant Address: CN Hong Kong
- Assignee: The Chinese University of Hong Kong
- Current Assignee: The Chinese University of Hong Kong
- Current Assignee Address: CN Hong Kong
- Agency: Fish & Richardson P.C.
- Priority: CN201710033338 20170118
- Main IPC: A61L31/14
- IPC: A61L31/14 ; A61B17/72 ; A61B17/80 ; A61L31/02 ; A61B17/00

Abstract:
The present disclosure discloses a hybrid implant system for fixing and repairing orthopedic fracture and a manufacturing method therefor. The hybrid implant system comprises an implant body having holes on both ends and a locking part configured for attaching the implant body to a broken bone through the holes. The hybrid implant system further comprises a healing assembly made from a material promoting healing of the bone. The implant body has at least one window on a side, the at least one window is aligned with a broken location of the bone, and the healing assembly is inserted into the window in a self-locking manner towards an interior of the implant body.
Public/Granted literature
- US20180207327A1 Hybrid Implant System and Manufacturing Method Therefor Public/Granted day:2018-07-26
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