Invention Grant
- Patent Title: Roller transfer application method and application device for hot-melt adhesive
-
Application No.: US15311810Application Date: 2014-08-22
-
Publication No.: US10525501B2Publication Date: 2020-01-07
- Inventor: Shoji Hidaka , Hisashi Sakai , Seiki Tarumi
- Applicant: Sun Tool Corporation
- Applicant Address: JP Osaka
- Assignee: SUN TOOL CORPORATION
- Current Assignee: SUN TOOL CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Norton Rose Fulbright US LLP
- Priority: JP2014-102918 20140517
- International Application: PCT/JP2014/072667 WO 20140822
- International Announcement: WO2015/177943 WO 20151126
- Main IPC: B05D7/24
- IPC: B05D7/24 ; B05D5/00 ; C09J5/00 ; B05C1/16 ; B05C1/08 ; B05D1/28

Abstract:
In a roller transfer application method for a hot-melt adhesive, a coater head having a slot in a direction towards an axis center of a pattern roller is provided to face a pattern surface of the pattern roller; and by supplying hot-melt adhesive, which is supplied from a hot-melt adhesive supply device, in a thin-film state to a pattern top surface of the pattern roller, thin-film hot-melt adhesive is thus only supplied to the top surfaces of protrusions of the pattern roller. By opening an on-off-type hot-melt adhesive supply control valve, which is attached to the coater head, at a timing that an adhesive opening (the slot) on the bottom surface of the coater head faces application zones on the pattern surface of the pattern roller, the hot-melt adhesive is supplied only to the top surfaces of the pattern roller protrusions.
Public/Granted literature
- US20170080454A1 ROLLER TRANSFER APPLICATION METHOD AND APPLICATION DEVICE FOR HOT-MELT ADHESIVE Public/Granted day:2017-03-23
Information query