Invention Grant
- Patent Title: Laser machining device and laser machining method
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Application No.: US15314182Application Date: 2015-03-30
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Publication No.: US10525553B2Publication Date: 2020-01-07
- Inventor: Takeshi Sakamoto , Yasunori Igasaki , Mamiko Matsunaga
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2014-111321 20140529
- International Application: PCT/JP2015/060006 WO 20150330
- International Announcement: WO2015/182238 WO 20151203
- Main IPC: B23K26/53
- IPC: B23K26/53 ; B23K26/066 ; B23K26/03 ; B23K26/046 ; B23K26/08 ; B23K26/067 ; C03B33/02 ; B23K26/00 ; B23K101/40 ; B23K103/00

Abstract:
A laser processing device includes: a laser light source emitting laser light; a converging optical system converging the laser light at an object to be processed; a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into 0th order light and ±nth order light (n is a natural number) including at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point; and a light blocking part blocking light to be converged at an outside with respect to the first processing light and the second processing light of the 0th order light and the ±nth order light to be converged at the object.
Public/Granted literature
- US20170216973A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD Public/Granted day:2017-08-03
Information query
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