Invention Grant
- Patent Title: Reversing machine and substrate polishing apparatus
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Application No.: US15248028Application Date: 2016-08-26
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Publication No.: US10525564B2Publication Date: 2020-01-07
- Inventor: Kenichi Akazawa , Kenichi Kobayashi , Akihiro Yazawa , Manao Hoshina
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2015-180502 20150914
- Main IPC: B24B41/00
- IPC: B24B41/00 ; B24B27/00 ; B08B3/02 ; B24B9/00

Abstract:
Disclosed is a reversing machine that reverses a substrate upside down. The reversing machine includes: a first arm pair configured to mount a substrate thereon; a second arm pair facing the first arm pair; an opening/closing mechanism configured to open/close the second arm pair so as to grip the substrate mounted on the first arm pair; and a rotating mechanism configured to rotate the first arm pair and the second arm pair around a predetermined axis that is set inside the first arm pair and the second arm pair and extends along an extension direction of the first arm pair and the second arm pair such that the substrate is reversed upside down.
Public/Granted literature
- US20170072531A1 REVERSING MACHINE AND SUBSTRATE POLISHING APPARATUS Public/Granted day:2017-03-16
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