Apparatus and method for drying thermoplastic resin prior to molding into plastic parts comprises a continuous loop liquid circuit for furnishing liquid at a prescribed temperature to a mold in which the plastic parts are fabricated; a continuous loop air circuit for passing heated dry air through a hopper containing the thermoplastic resin thereby drying the thermoplastic resin to a prescribed level of dryness; and a coupling thermally connecting the two circuits for heat transfer from the liquid to the drying air; the liquid is selected from the group comprising water and ethylene glycol; microprocessor control facilitates generation and retention of custom water temperature and resin dryness/temperature optionally based on machine learning principles.