Invention Grant
- Patent Title: Pressure-sensitive adhesive sheet
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Application No.: US15445061Application Date: 2017-02-28
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Publication No.: US10525668B2Publication Date: 2020-01-07
- Inventor: Kenji Furuta , Yoshio Terada , Tadashi Takahashi , Mitsuhiro Kanada
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Hauptman Ham, LLP
- Priority: JP2016-039903 20160302; JP2017-009329 20170123
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/36 ; B32B37/12 ; C09J133/06 ; C09J7/38 ; C09J7/22 ; C09J7/29 ; C09J7/28 ; B32B15/082 ; B32B15/085 ; B32B15/088 ; B32B15/09 ; B32B15/12 ; B32B15/18 ; B32B15/20 ; B32B27/08 ; B32B27/10 ; B32B27/28 ; B32B27/30 ; B32B27/32

Abstract:
A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.
Public/Granted literature
- US20170253773A1 PRESSURE-SENSITIVE ADHESIVE SHEET Public/Granted day:2017-09-07
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