Invention Grant
- Patent Title: Adhesive resin compositions and laminates using the same
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Application No.: US15572527Application Date: 2016-05-02
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Publication No.: US10525682B2Publication Date: 2020-01-07
- Inventor: Yoshihiro Zennyoji
- Applicant: RIKEN TECHNOS CORPORATION
- Applicant Address: JP Tokyo-To
- Assignee: RIKEN TECHNOS CORPORATION
- Current Assignee: RIKEN TECHNOS CORPORATION
- Current Assignee Address: JP Tokyo-To
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-095889 20150508
- International Application: PCT/JP2016/063556 WO 20160502
- International Announcement: WO2016/181880 WO 20161117
- Main IPC: H01B7/08
- IPC: H01B7/08 ; B32B27/32 ; C09J123/26 ; C09J7/24 ; B32B27/38 ; C09J123/12 ; H01B3/42 ; H01B3/44 ; H01B7/295

Abstract:
Provided is adhesive resin compositions comprising (A) 30 to 70% by mass of an acid-modified polypropylene-based resin; (B) 20 to 60% by mass of a polypropylene-based resin; and (C) 2 to 20% by mass of a copolymer of ethylene and one or more kinds of comonomers selected from the group consisting of vinyl acetate, alkyl methacrylate, and alkyl acrylate, with the proviso that the sum of the percentages of the above component (A), the above component (B), and the above component (C) is 100% by mass.
Public/Granted literature
- US20180154620A1 ADHESIVE RESIN COMPOSITIONS AND LAMINATES USING THE SAME Public/Granted day:2018-06-07
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