Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, and piezoelectric device
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Application No.: US16127758Application Date: 2018-09-11
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Publication No.: US10525707B2Publication Date: 2020-01-07
- Inventor: Masao Nakayama , Shunya Fukuda , Eiju Hirai , Shiro Yazaki , Hajime Nakao
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2017-175476 20170913
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid ejecting head includes a flow path forming substrate, a vibration plate that is formed on one surface side of the flow path forming substrate, a plurality of piezoelectric elements that are provided on the vibration plate, a protective substrate that is bonded to the one surface side of the flow path forming substrate and has a flow path, a flow path member that is bonded to a side of the protective substrate opposite to the flow path forming substrate, a drive circuit that is mounted in a space formed so as to be surrounded by the flow path forming substrate, the protective substrate, and the flow path member, a filler that is filled between the drive circuit and the protective substrate, and a protective film that is formed on an inner wall, in which the protective film has an exposure hole exposing a surface of the filler.
Public/Granted literature
- US20190077149A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE Public/Granted day:2019-03-14
Information query
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