A thermal transfer ink composition, a domestic thermal transfer kit, and a thermal transfer method is provided. The thermal transfer ink composition comprises a disperse dye, a resin, an additive, an auxiliary solvent and a main solvent. The domestic thermal transfer kit comprises an ink cartridge, a writing instrument, high temperature resistant tapes and writing media. The writing instrument comprises a cotton core type, a capillary liquid type and a valve type; The method comprises the following steps: using a writing instrument to form writing marks on the surface of a writing medium; pasting the writing medium onto the surface of a thermal transfer medium by the use of high temperature resistant tapes; applying a heat source to the writing medium and then removing the heat source to obtain the well-transferred thermal transfer medium.