Invention Grant
- Patent Title: Refrigeration cycle device
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Application No.: US15566892Application Date: 2016-04-13
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Publication No.: US10527330B2Publication Date: 2020-01-07
- Inventor: Sachio Sekiya , Masanao Kotani
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2015-089325 20150424
- International Application: PCT/JP2016/061882 WO 20160413
- International Announcement: WO2016/171052 WO 20161027
- Main IPC: F25B41/06
- IPC: F25B41/06 ; F25B13/00 ; F24F11/65 ; F24F11/89

Abstract:
In a refrigeration cycle device, a compressor, a heat exchanger serving as a condenser, an expansion valve, and a heat exchanger serving as an evaporator are connected in order through refrigerant piping to form a refrigeration cycle. The refrigeration cycle device includes an evaporation temperature sensor provided between the expansion valve and the exchanger serving as the evaporator. The opening degree of the expansion valve is controlled such that an evaporation temperature detected by the evaporation temperature sensor reaches a control target value of the evaporation value. As a result, the refrigeration cycle device capable of achieving enhanced controllability while preventing liquid back to the compressor is provided.
Public/Granted literature
- US20180100677A1 Refrigeration Cycle Device Public/Granted day:2018-04-12
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