A heat transfer device, and methods and systems using such devices, including a major surface wall forming a bottom side of the device; a first hermetic chamber of a first design and with the surface wall forming a bottom wall of the first vapor chamber; a second hermetic chamber of a second design, positioned adjacent to the first chamber along a length of the first surface wall, and with the surface wall forming a bottom wall of the second vapor chamber. The first chamber includes a first heat transfer medium and a first wick arranged to transport the first heat transfer medium to an evaporator region of the first chamber. The second chamber includes a second heat transfer medium and a second wick arranged to transport the second heat transfer medium to an evaporator region of the second chamber.