Invention Grant
- Patent Title: Chip on glass protection
-
Application No.: US15836106Application Date: 2017-12-08
-
Publication No.: US10527896B2Publication Date: 2020-01-07
- Inventor: Michael G. Abernathy , Mark W. Fletcher , Sanjay Tripathi
- Applicant: L3 Technologies, Inc.
- Applicant Address: US NY New York
- Assignee: L3 TECHNOLOGIES, INC.
- Current Assignee: L3 TECHNOLOGIES, INC.
- Current Assignee Address: US NY New York
- Agency: Dickinson Wright PLLC
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; H01L23/552 ; H01L27/12 ; G02F1/1333 ; H01L27/32

Abstract:
Various circuits may benefit from suitable protection. For example, certain displays, such as active matrix liquid crystal displays, may benefit from enclosures configured to protect driver circuits from high intensity radiated fields. A system can include a first protective conductive coating layer. The system can also include a first insulating layer on the first protective conductive layer. The system can further include a signal conductive layer on the insulating layer. The system can additionally include a driver layer mounted to the signal conductive layer. The system can also include a second insulating layer above the driver layer. The system can further include a second protective conductive coating layer on the second insulating layer. The system can additionally include one or a plurality of conductive elements disposed between the first protective conductive coating layer and the second protective conductive coating layer to form an enclosure around the driver layer.
Public/Granted literature
- US20190179187A1 CHIP ON GLASS PROTECTION Public/Granted day:2019-06-13
Information query
IPC分类: