Invention Grant
- Patent Title: Method for producing electrical wiring member and electrical wiring member
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Application No.: US15523452Application Date: 2015-10-22
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Publication No.: US10527938B2Publication Date: 2020-01-07
- Inventor: Hideaki Nada , Hiroaki Uefuji , Hirotaka Shigeno , Yoshihiro Sakata , Yuki Matsui , Hisaya Takayama
- Applicant: NISSHA PRINTING CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: NISSHA CO., LTD.
- Current Assignee: NISSHA CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2014-225611 20141105; JP2015-067616 20150327
- International Application: PCT/JP2015/079789 WO 20151022
- International Announcement: WO2016/072274 WO 20160512
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G06F3/044 ; H01B5/14 ; G03F7/09 ; G03F7/11 ; H01B13/00 ; H05K9/00

Abstract:
[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered film 6 of a Cu layer 3 and CuNO-based blackening layers (2a and 2b); a step of forming a resist layer 4a in a predetermined region on the layered film 6; and a step of removing a partial region of the layered film 6 by bringing the layered film 6 into contact with an etchant.
Public/Granted literature
- US20170307974A1 METHOD FOR PRODUCING ELECTRICAL WIRING MEMBER AND ELECTRICAL WIRING MEMBER Public/Granted day:2017-10-26
Information query
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